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Summer Scholars Program

Introduction

The Abraham Lincoln Presidential Library and Museum (ALPLM) Summer Scholars Program is a non-residential program designed to assist area high school students as they prepare for college entrance exams and future career aspirations. Each summer, fifteen to eighteen Summer Scholars spend two weeks working and researching at the Library and Museum in Springfield, Illinois. Guided by a team of educators, they will visit local historic sites, attend workshops led by historians and other prominent professionals, and work with Library and Museum staff to create a final project, showcasing their work as photojournalists, graphic designers, webmasters, museum curators, and research historians.

The program is funded by a generous grant from the National Recreation Foundation and is administered by the Abraham Lincoln Presidential Library Foundation. For more information download a Summer Scholars 2008 Brochure or contact the program director via email at: Erin.Bishop@illinois.gov

Eligibility

The program is open to students entering their sophomore year through 2008 high school graduates.

Remuneration

Summer Scholars are not paid but do receive meals and a transportation stipend to attend the program.

Duration

The program is a two week, non-residential program running 9:00 a.m. to 4:30 p.m. from July 28-August 8, 2008. On Saturday, August 9

Deadlines

Application Deadline is May 1, 2008

Application Procedure

Step 1: Complete the Summer Scholars Application Form (also signed by a parent or guardian)

Step 2: Compose a letter of interest stating:
• Why you want to participate in the Summer Scholar Program
• Your personal goals
• What you hope to achieve from this experience
• What you believe you have to contribute to the program
• Any special interests or abilities
• Please limit your letter to no more than 500 words.

Step 3: Mail your completed application and letter of interest to:
ALPLM Summer Scholars Program
Education Division
212 North Sixth Street
Springfield, IL 62701

DEADLINE: May 1, 2008





 


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